EDUCATION
CHAPTER 65
RURAL AND UNDERSERVED EDUCATOR INCENTIVE PROGRAM
33-6504. LOAN REPAYMENT ASSISTANCE — EDUCATIONAL EXPENSES REIMBURSEMENT — ELIGIBILITY AND AWARD CRITERIA. (1) Loan repayment assistance or the reimbursement of eligible education expenses may be provided on behalf of a rural and underserved educator who:
(a) Is employed in a school identified pursuant to section 33-6503, Idaho Code;
(b) Has a signed contract with such school; and
(c) Has an educational loan that is not in default and that has a minimum unpaid current balance of at least one thousand dollars ($1,000) or has at least one thousand dollars ($1,000) in eligible education expenses at the time of application; or
(d) Has eligible education expenses that may be reimbursed pursuant to this chapter.
(2) To qualify for loan repayment assistance or education expense reimbursement under this chapter, a rural and underserved educator shall submit an application to the state board of education. For loan repayment applications, the application must include official verification or proof of the applicant’s total unpaid accumulated educational loan debt and any other documentation as required by the state board of education for verification of the applicant’s eligibility.
(3) A rural and underserved educator is eligible for loan repayment assistance or eligible educational expenses for up to four (4) years, provided that the educator remains employed at the same school or by the same school district. The state board of education may remit payment of the loan on behalf of the rural and underserved educator in accordance with the requirements of this chapter and rules promulgated by the state board of education.
(4) The total incentive award shall be:
(a) One thousand five hundred dollars ($1,500) for the first year;
(b) Two thousand five hundred dollars ($2,500) for the second year;
(c) Three thousand five hundred dollars ($3,500) for the third year; and
(d) Four thousand five hundred dollars ($4,500) for the fourth year.
History:
[33-6504, added 2022, ch. 227, sec. 1, p. 746.]